Unlimited Variety with WAGO
Reflow soldering is the standard method for soldering SMD components. By using high-temperature resistant plastic and a streamlined pin design, WAGO Through-Hole Reflow (THR) components meet the requirement for SMT process capability. WAGO has a comprehensive range of THR-capable components.
THR Temperature Benefit
Through-Hole Reflow (THR) is a soldering process whereby the solder paste is applied to the PCB by using a template. Heating the solder paste contained in the holes will cause the paste to melt with the component pins. WAGO "THR" products are designed to be soldered in high-temperature ovens.
| PCB Terminal Blocks | Series | Pin spacing/ mm | for conductor sizes/ mm² | Voltage/V | Current/A |
|---|---|---|---|---|---|
 |
218 | 2.5 and 2.54 | 0.08 - 0.5 | 160 | 6 |
 |
250 | 2.5 | 0.2 - 0.5 | 160 | 4 |
 |
250 | 3.5 | 0.2 - 1.5 | 320 | 8 |
 |
236 | 5 | 0.08 - 2.5 | 320 | 24 |
 |
2081 | 3.5 | 0.2 - 1.5 | 160 | 17.5 |
| MULTI CONNECTION SYSTEM | Series | Pin spacing/ mm | Male connectors
(straight & angled) |
Voltage/V | Current/A |
|---|---|---|---|---|---|
 |
733 | 2.5 | 1.0 x 1.0 mm pins | 160 | 6 |
 |
734 | 3.5 - 3.81 | 1.0 x 1.0 mm pins | 160 | 10 |
 |
231 | 5 | 1.0 x 1.0 mm pins | 320 | 12 |
|
231 | 5 | 1.2 x 1.2 mm pins | 320 | 16 |
 |
231 | 7.5 | 1.0 x 1.0 mm pins | 630 | 12 |
|
231 | 7.5 | 1.2 x 1.2 mm pins | 630 | 16 |
 |
713 | 3.5 | 0.8 x 0.8 mm pins | 160 | 10 |
