- SMD PCB terminal blocks with PUSH WIRE® connection technology
- Push-in termination of solid conductors
- Easy conductor removal via operating tool
- Height of just 2.7 mm
- Assemble terminal blocks without pole loss
- Available in tape-and-reel packaging for automated assembly
Note:
Application notes:
Suitable for lead-free, reflow-soldering profiles per DIN EN 61760-1 and IEC 60068-2-58 up to max. 260°C peak temperature. Due to application-specific variables (component configuration and orientation, type of soldering machine, solder paste), trial runs are recommended to ensure product and process compatibility under actual manufacturing conditions.
Note:
Depending on reflow soldering temperatures and times, color deviations may occur. These deviations will have no impact on functionality.
Recommendation:
Recommendation for stencil:
Material thickness: 150 µm; Pattern layout identical to solder pad layout